Wafer processing system

摘要

A processing system for processing of wafers that are formed by slicing a cylindrical workpiece which is adhered to a support plate by an adhesive agent. The processing system includes a washing apparatus, a removing apparatus, a separating apparatus, and a transferring apparatus. The washing apparatus washes the wafers that are remained adhered to the support plate. The removing apparatus removes a group of the wafers from the support plate. The removed wafers are gathered in a cylindrical shape. The separating apparatus separates the wafers one by one. The separating apparatus includes a vessel for accommodating the wafers separated one from another. The transferring apparatus transfers the wafers from the washing apparatus to the removing apparatus and then to the separating apparatus.