| 摘要 |
PROBLEM TO BE SOLVED: To enable electronic components obtained by punching out a film carrier to be accurately mounted on a board such as a display panel and with high in workability. SOLUTION: A punching equipment 40 provided to an electronic component mounting equipment of a display panel 60 is composed of a lower die 42, where a through-hole is provided and a punch 50 which punches out a film carrier 1A moving inside the through-hole in the vertical directions, and a transfer nozzle 13 is provided below the through-hole to vacuume-attract an electronic component 7 obtained by punching with the punch 50 and to deliver it to a transfer nozzle 54. Therefore, the electronic component 7 obtained by punching the film carrier 1A is received by the transfer nozzle 13, delivered to the transfer nozzle 54, and then surely mounted on the display panel 60. |
