| 摘要 |
PROBLEM TO BE SOLVED: To enable circuit members, each equipped with a connection terminal, to be connected together with high reliability in connection by a method, wherein a protrudent electrode of metal with low melting point is made to serve as the first connection terminal of a first circuit member of the second connection terminal of a second circuit member, and the protrudent electrode is prescribed in height. SOLUTION: A semiconductor element is dipped into a metal molten bath filled with metal low-melting point whose melting point is about 250 deg.C or below, and ultrasonic energy is applied to an electrode forming surface at a right angle at the same time, whereby a protrudent electrode 4 of thickness 5 to 40μm is formed on an electrode pad. Therefore, the protrudent electrode 4 is formed of a metal low-melting point, so that the protrudent electrodes 4 can be easily deformed by heating applied in a connecting operation to absorb irregularities in height, even if the protrudent, electrodes 4 are irregular in height, and the electrodes 4 are easily ensured of their own contacting area and can be enhanced in connection reliability. A metal bump can be formed on the connection electrode of a circuit member at a low cost. |
