PASSIVE ALIGNMENT MEMBER FOR VERTICAL SURFACE EMITTING/DETECTING DEVICES

摘要

The present invention relates to the use of the (110) crystalline silicon as the optical bench for the optoelectronic devices in a mini-MT transceiver package. This reduced footprint transceiver package requires the use of vertical transmitting (104) and receiving (103) devices which are passively aligned in a precise manner to optical fibers. The (110) crystalline silicon is anisotropically etched to reveal diamond-shaped holes with precise edges which receives alignment pins (106) at right angles to the surface emitting (104) or receiving (103) devices mounted on the alignment frame. The holes are etched by standard etching techniques in a wet-etch process of the wafer exposing (111) crystalline planes that serves as excellent vertical registration surfaces for locating the pins.