| 摘要 |
Curable functionalized imide-linked polyimides compounds have been synthesized that have been found to possess very low dielectric constant and extremely low dissipation factor. These compounds also have a range of high to low modulus, extremely low moisture uptake and are very thermally stable. The combination of these materials in formulation along with functionalized polyethylene, polypropylene, polybutadiens have been found to be ideal for forming films and coatings for the microelectronic applications, multiplayer capacitors and interconnects, and high power cables and wire coatings. The addition of perfluorinated hydrocarbons, and POSS nanoparticles to the formulations have decreased the dielectric constant and dielectric dissipation factor further, and have also improved the flammability of the compositions. |
