WAFER LOADING AND UNLOADING EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To prevent a wafer from falling outside the facility and being broken. SOLUTION: This equipment has a main body 110, a wafer chuck vertical transferring section 115, which being located on the main body 110, displaces a wafer chuck in the vertical direction, and a wafer chuck horizontal transferring section 160 being joined to the wafer chuck vertical transferring section 115, displaces a wafer chuck in the horizontal direction. The wafer chuck horizontal transferring section 160 is joined with a wafer chuck driving section 155 for widening an narrowing the distance between a pair of wafer chucks 124, 126. In the wafer chuck driving section 155, a wafer slip-out preventive section 130 is provided between the wafer chucks 124, 126 and moves along the wafer chuck driving section 155.