| 摘要 |
PROBLEM TO BE SOLVED: To shorten treatment time and perform uniform treatment by heating the fluid through irradiating a heating pipe in which the fluid passes with microwave. SOLUTION: An object to be treated 4 such as a semiconductor wafer is placed in a treatment tank 1, then a treatment liquid feed valve 16 is opened to send a treatment liquid (fluid) 2 to mixing device 19 from a treatment liquid storage tank 17. Further, the treatment liquid 2 is fed to a microwave heating device 20 through a filter 7 after passage of the treatment liquid 2 through a nozzle, and is heated by the microwave from a microwave generation device 21. Next, the treatment liquid 2 is fed into the treatment tank 1 passing through a throttle valve 22, and when the liquid level 3 of the treatment liquid 2 reaches a specified liquid level, the liquid 2 overflows into a treatment liquid receiving tank 5. When the liquid level of the tank 5 is detected by a liquid level detection device 9, the treatment liquid feed valve 16 is closed and a treatment liquid circulatory valve 23 is opened to circulate the treatment liquid 2 from the treatment liquid receiving tank 3 with the help of a first pump 18. Thus it is possible to heat the treatment liquid 2 in a short time in such a state that the saturated pressure of the liquid 2 is increased, and effectively heat the liquid 2 to obtain the treatment liquid 2 whose density is uniform and achieve stable treatment of the object to be treated.
|
