发明名称 SPUTTERING TARGET MATERIAL FOR FORMING DIELECTRIC THIN FILM, AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To form a film at a high speed by the high-power sputtering by specifying the total composition ratio and making a metal Pb, the La-Zr-Ti oxide phase, and the Zr-Ti oxide phase as the constituted phase. SOLUTION: A sputtering target has the composition of Pb1+m-x Lax Zry Ti1-y Oz (0<=m<=2, 0<x<0.3, 0.2<y<0.8, 1<=z<=2.5). The volumetric ratio of the metal Pb to the whole volume of the sputtering target for forming a dielectric thin film is >=45%, the metal Pb powder, the La-Zr-Ti oxide powder and the Zr-Ti oxide powder are mixed and formed into a prescribed shape, and preferably sintered under the pressure at a temperature of not higher than the melting point of Pb in the vacuum or inert atmosphere. The thin film formed on a substrate using the target material is high in occupation ratio of the metal Pb at the erosion surface of the material, the discharge during the sputtering is stable, and the composition of the thin film is stable.
申请公布号 JPH11229126(A) 申请公布日期 1999.08.24
申请号 JP19980031213 申请日期 1998.02.13
申请人 MITSUBISHI MATERIALS CORP 发明人 WATANABE KAZUO;MISHIMA TERUSHI;MARUYAMA HITOSHI
分类号 C04B35/49;C23C14/08;C23C14/34;H01B3/12;H01L21/203 主分类号 C04B35/49
代理机构 代理人
主权项
地址