发明名称 CATHODE ARC VAPOR DEPOSITION
摘要 <p>The invention relates to sacraficial cathode electric arc vapor deposition apparatus and processes to provide an improved plasma flow control. A pair of anti-parallel magnetic field generators (6, 7) create a characteristic cusp shaped magnetic field (8) in the vicinity of cathode working surface (2). The magnetic field (8) defines electron-trapping cusp (9). Electric field lines (15) interact with magnetic field (8) to control the plasma flow onto substrate (5). The described configuration directs the plasma at a higher rate per unit of magnetic field strength. Consequently a more stable arc discharge per unit of applied electrical current is possible. In addition, the coatings generated from the present invention result in improved quality and corrosion resistance.</p>
申请公布号 WO1999041425(A1) 申请公布日期 1999.08.19
申请号 US1999002530 申请日期 1999.02.05
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