FORMATION OF SOLDER BUMP AND DEVICE THEREOF,申请号JP19980024876-传众专利搜索

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发明名称	FORMATION OF SOLDER BUMP AND DEVICE THEREOF
摘要
申请公布号	JPH11224980(A)	申请公布日期	1999.08.17
申请号	JP19980024876	申请日期	1998.02.05
申请人	OKI ELECTRIC IND CO LTD	发明人	MURAISHI MITSUMASA
分类号	H05K3/34;(IPC1-7):H05K3/34	主分类号	H05K3/34
代理机构		代理人
主权项
地址

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