| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC card module and an IC card capable of being made thin, easily holding and connecting an antenna line to a bump on a pad and improving the reliability of connection between the pad and the antenna line, and a manufacturing method therefor. SOLUTION: This IC card module having an IC chip 1, pads 2 to be electrodes formed on the IC chip 1, Au bumps 4 formed on respective pads 2, and antenna lines 3 connected to the bumps 4 is stored in a core material 5 having the same dimension as the thickness of the chip 1 and a hot melt material 6 is stuck to the outsides of the module and the core material 5 so that the thickness of the chip 1 is the same as that of the module. |
