发明名称 METHOD FOR PILING UP PACK OF PRINTED CIRCUIT BOARD AND PACK LOADING REMOVAL DEVICE MACHINING MACHINE
摘要 PROBLEM TO BE SOLVED: To achieve piling up so that an accommodation space can be reduced, by arranging additional packs on each pack, and inserting the positioning member of the additional packs into the inside of the hole part of each pack being arranged horizontally. SOLUTION: A pack 1 is provided with a plurality of sets of hole parts 8 and 9 corresponding to the length of a set of positioning pins 5 and 6 and the thickness of the pack 1 itself on each of two surfaces being demarcated by a center line A. The hole parts 8 and 9 are aligned with the pins 5 and 6 along two lines that are in parallel with the edge part 9, and the hole parts 8 and 9 are arranged along each line and at an equal distance for the pins 5 and 6. Then, the pack 1 is piled up by inserting the positioning pins 5 and 6 into the hole parts 8 and 9 of one or two or more additional packs being arranged horizontally and by shifting them.
申请公布号 JPH11220291(A) 申请公布日期 1999.08.10
申请号 JP19980312657 申请日期 1998.09.29
申请人 BORGOTEC TECNOL PER L AUTOM SPA 发明人 RAITERI ANGELO
分类号 B65G57/02;B23Q7/00;B65G57/16;H05K3/00;H05K13/00;H05K13/02 主分类号 B65G57/02
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