| 摘要 |
PROBLEM TO BE SOLVED: To shorten an inspection time, to prevent another wafer failure from occurring during transportation between inspection devices, and reduce the size of a clean room, by performing quality inspection for both front and rear surfaces of a silicon wafer at the same time. SOLUTION: The outer periphery of a silicon wafer W is held and set to an inspection position. With this state kept, a foreign substance, flaw, projection, COP(crystal originated particle), and stain, etc., on a front surface w1 and a rear surface w2 of the wafer W are inspected at the same time. Thus inspection time is shortened while occurrence of another wafer failure during transportation between a first and a second particle detection devices 12 and 13 is prevented, and further, the size of a clean room housing the first and the second particle detection devices 12 and 13 is reduced. |
