| 摘要 |
PROBLEM TO BE SOLVED: To attain improvement in ground measures and noise resistance characteristics. SOLUTION: An electric circuit board 26 is mounted on a mount part 14 of a metallic lead frame 12, parts X and Y of a metallic package 28 as the component of a sub assembly A are fixed on hook-shaped extension parts 16 and 18 extended at two parts of the mount part 14 by welding and these mount part 14, extension parts 16 and 18, electric circuit board 26, metallic package 28 and welded parts X and Y are sealed by resin. The unwanted part of the metallic lead frame 12 is cut and removed and bending work is performed to plural external lead pins 4 and 6 provided on both the sides of the mount part 14 so that a dual inline package(DIP) type optical module can be provided. |
