| 摘要 |
PROBLEM TO BE SOLVED: To make the structure of cooling members appropriate to stack assembly of stacked and pressure-sintered hollow cooling members for flowing a refrigerant to a pressure current flat power semiconductor device having a plurality of parallel disposed chips so that approximately equal plane pressures are applied to the chips of the semiconductor device, and avoid thermal or mechanical damages to improve the reliability. SOLUTION: In a cooling member 3 (a hollow box for flowing refrigerant inside) which is laid on a package of a flat IGBT (semiconductor device) 2 having a plurality of chips 2b arranged in longitudinal and transverse rows and held between electrode plates 2a and built in a stack, auxiliary ribs 3a aerving as heat transfer fins disposed therein are discursively disposed on a plane area facing a chip pressure plane aligningly with an array pattern of the chips built in a power semiconductor device. Concretely, the auxiliary ribs are individually face the chips of the flat IGBT and regulated so as to remain in the chip pressure plane to avoid the plane pressure lack or excess of each chip. |
