| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device wherein an interconnect base and resin cover are tightly bonded, the semiconductor element can be normally and stably operated for a long time by completing the hermetic seal of a semiconductor element by the resin cover and electrodes of the semiconductor elements can be surely and tightly connected to specified external electric circuits. SOLUTION: The semiconductor device is composed of a square-shaped mount 1a on the top face of which a semiconductor element 5 is mounted, insulation base 1 to which a plurality of wiring layers 2 for electrically connecting electrodes of the semiconductor element 5 mounted on the mount 1a are deposited, semiconductor element 5 mounted on the mount 1a of the insulation base 1, and a resin cover 7 deposited to the surface of the semiconductor element 5 and insulation base 1 top face for hermetically sealing the semiconductor element 5. In this case the insulation base 1 has steps 1b at least at four corners of the top face. |
