发明名称 Wire clamper for bonding apparatus
摘要 A wire clamper for a bonding apparatus includes a pair of clamper arms having tip portions, respectively. The tip portions clamp or release a wire therebetween when at least one of the clamper arms is operated. The wire clamper further includes a giant-magnetostrictive actuator having a giant-magnetostrictive alloy and a coil wound around the giant-magnetostrictive alloy for generating a magnetic field. The giant-magnetostrictive alloy is displaced according to the magnetic field generated by the coil so as to operate at least one of the clamper arms.
申请公布号 US5931452(A) 申请公布日期 1999.08.03
申请号 US19980021549 申请日期 1998.02.10
申请人 TOSOK CORPORATION;MORITEX CORPORATION;ETREMA PRODUCTS, INC. 发明人 NAKATOMI, YOSHIHARU;MATSUI, YASUHIRO
分类号 H01L21/60;B23K20/00;H01L41/12;(IPC1-7):B25B1/06 主分类号 H01L21/60
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