| 摘要 |
PROBLEM TO BE SOLVED: To narrow a width of an exposing apparatus itself and make the apparatus compact by mounting a plurality of light-emitting element chips to a common mount substrate, and connecting to the common mount substrate a flexible substrate where a driver chip for driving the plurality of light-emitting element chips is mounted. SOLUTION: In a semiconductor process at an exposing apparatus 30, a plurality of light-emitting element chips 1 constituted of light-emitting elements arranged in two arrays approximately parallel to each other are set on a mount substrate 4. The mount substrate is fixed by an adhesive material, a screw or the like means to an opposite face 12a to a photosensitive drum 2 of a member 12 serving also to radiate heat. Flexible substrates 5, 6 where driver chips 5, 6 for driving each light-emitting element and a limiting resistor, etc. are mounted are fixed by a suitable fixing means to face, etc. 12b, 12c of the member 12 different from the fixation face 12a to face each other. Each flexible substrate 5, 6 is electrically connected to the mount substrate 4. The exposing apparatus 30 is made compact accordingly. |
