发明名称 STRUCTURE OF PACKAGING BODY FOR RECTANGULAR THIN ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To facilitate the taking out of an electronic part from a filling hole, by a method wherein for a packaging body wherein at least one filling hole is provided on corrugated fiberboard, the filling hole is provided in such a manner that all of the four internal surfaces at the filling hole may tilt based on the direction of a step at the center of the corrugated fiberboard. SOLUTION: When a thermal printing head A comprising a head substrate A1 made of ceramic, a heating resistor A2 for printing, and a plurality of lead terminals A3, is packaged, a plate-shaped body 1 made of paper, which forms the bottom for a packaging body is made of corrugated fiberboard, and on the upper surface of the plate-shaped body 1, a corrugated fiberboard 2 where two filling holes 3 are provided, is superposed. These filling holes 3 are provided in such a manner that all of the four internal surfaces 3a-3d at the filling holes 3 may tilt at a proper angleθbased on the direction of a step at the center of the corrugated fiberboard 2. By this method, the head substrate A1 which is housed in each filling hole 3, can be surely prevented from going under a gap part between front and rear both liners of the corrugated fiberboard 2.
申请公布号 JPH11208762(A) 申请公布日期 1999.08.03
申请号 JP19980015860 申请日期 1998.01.28
申请人 ROHM CO LTD 发明人 HOKI HIDEAKI;YOKOYAMA EIJI;YOSHIKAWA YASUHIRO
分类号 B65D85/86;(IPC1-7):B65D85/86 主分类号 B65D85/86
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