发明名称 |
Photo-curable resin composition and process for preparing resin-basedmold |
摘要 |
A photo-curable resin composition suitable as a material for photo-fabricating and capable of producing cured products with excellent mechanical strength and high heat resistance. Further disclosed is a process for molding a resin-based mold which provides superior molding dimensional precision and superb repetition durability. The resin composition contains a monomer component containing (A) 30-70 wt % of a polyfunctional unsaturated monomer having a cyclic structure and (B) 70-30 wt % of a monofunctional unsaturated monomer having a cyclic structure of which the homopolymer has a glass transition temperature (Tg) of 70 DEG C. or higher; (C) a photo-initiator; and (D) an inorganic filler having an average particle diameter or an average fiber length of 1-50 mu m, wherein the ratio of the inorganic filler to 100 parts by volume of the monomer components and the photo-initiator is 100-160 parts by volume, and the heat distortion temperature of the cured resin produced from the photo-curable resin composition is 100 DEG C. or higher.
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申请公布号 |
US5932625(A) |
申请公布日期 |
1999.08.03 |
申请号 |
US19970865676 |
申请日期 |
1997.05.30 |
申请人 |
DSM N.V.;JSR CORPORATION;JAPAN FINE COATINGS CO., LTD. |
发明人 |
WATANABE, TSUYOSHI;MATSUMURA, AYAO;HARUTA, YUICHI;UKACHI, TAKASHI |
分类号 |
C08F2/44;C08F2/46;C08F2/48;C08F222/10;C08F226/06;(IPC1-7):C08F2/46;B27N3/08 |
主分类号 |
C08F2/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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