发明名称 HIGH-DENSITY COMPUTER MODULES WITH STACKED PARALLEL-PLANE PACKAGING
摘要 <p>A module for insertion into an expansion slot of a computer includes a primary board (62) and a pair of auxiliary boards (64a, 64b). The auxiliary boards are mounted in a spaced relationship on respective sides of the primary board to define air paths between the boards. The air paths allow air to circulate between the boards. The auxiliary boards each have a trace (72) for electrically connecting the board to the primary board, and the primary board has a trace (70) for connecting chips (68) mounted thereon to an interface with the expansion slot. The traces of the auxiliary boards are substantially the same length. The trace of the primary boards is only slightly longer than the traces of the auxiliary boards.</p>
申请公布号 WO1999036959(A1) 申请公布日期 1999.07.22
申请号 US1999001006 申请日期 1999.01.19
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