| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent damage from being inflicted on a semiconductor wafer when a sheet member is bonded to the wafer. SOLUTION: A buffer member 16 is arranged on the upper surface of a wafer placement part 18 of a wafer support unit 17 and a semiconductor wafer 1 is arranged on the member 16 in such a way that electrodes 5 formed on the main surface 1a on one side of the main surfaces 1a and 1b of a semiconductor wafer 1 are made contact with the member 16. After that, a bonding agent layer 8 on a sheet member 10 is made to made contact with the upper part of the other main surface 1b of the wafer 1 to press the member 10 toward the placement part 18 and the member 10 is cut out into a circular form in a diameter larger than that of the wafer 1. A pressing force to press the member 10 to the wafer 1 is relaxed by the member 16 and 8 break or a crack can be prevented from being generated in the wafer 1.</p> |
