发明名称 |
Electrophoretically active sol-gel processes to backfill, seal, and/or densify porous, flawed, and/or cracked coatings on electrically conductive material |
摘要 |
Electrophoretically active sol-gel processes to fill, seal, and/or density porous, flawed, and/or cracked coatings on electrically conductive substrates. Such coatings may be dielectrics, ceramics, or semiconductors and, by the present invention, may have deposited onto and into them sol-gel ceramic precursor compounds which are subsequently converted to sol-gel ceramics to yield composite materials with various tailored properties.
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申请公布号 |
US5925228(A) |
申请公布日期 |
1999.07.20 |
申请号 |
US19970781069 |
申请日期 |
1997.01.09 |
申请人 |
SANDIA CORPORATION |
发明人 |
PANITZ, JANDA K.;REED, SCOTT T.;ASHLEY, CAROL S.;NEISER, RICHARD A.;MOFFATT, WILLIAM C. |
分类号 |
C23C4/18;C23C26/00;C25D13/00;(IPC1-7):C25D13/02 |
主分类号 |
C23C4/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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