SEMICONDUCTOR ASSEMBLY

摘要

A semiconductor assembly of strip-pattern construction is specified which has a semiconductor component (HL) on a carrier section (T) of an earth part in the form of strips (M). The earth part in the form of strips has an extension section (V) by means of which it is extended beyond the carrier section and which is folded over, with respect to the carrier section, in such a way and has such a length that it covers the semiconductor component in order to screen the latter electromagnetically. In this assembly, the earth part in the form of strips has a multiple function. Specifically, it serves not only for carrying and making contact with electrical components, but it also acts as an electromagnetic screen for a semiconductor component, e.g. for the radiation detector of a remote-control receiver module. This screen is reliably bonded to earth, as it is fashioned in one part with the earth lead, it is simple to manufacture because no special process steps for bonding are required, and it saves space, as no room is required for stable bonding points between the screen and other parts of the assembly.