| 摘要 |
PROBLEM TO BE SOLVED: To provide a molding equipment and a method, in which a molding technique is improved in quality and a molding capacity is improved. SOLUTION: This molding equipment is composed of a lower molding die 7 and an upper molding die 8, which are assembled to form a cavity 9 that corresponds to the encapsulating body of a quad flat package(QFP), a pot 11 which is fixed to the lower molding die 7 and possessed of a feed opening 11a and an inlet opening 11b which communicate with the cavity 9, a frame transfer body 21, which supports and transfers a lead frame 2 mounted with a semiconductor chip 1 over the cavity 9 of the lower molding die 7 when the molding dies 7 and 8 are opened, and a tablet transfer body 22 which supports and transfers a tablet 13 between the inlet opening 11b of the pot 11. In this case, the tablet 13 is pressed with a plunger 12 to be introduced into the pot 11 through the inlet opening 11b, the molding dies 7 and 8 are clamped, encapsulating resin is injected into the cavity 9 through the feed opening 11a of the pot 11 to encapsulate the semiconductor chip 1 with resin. |
