| 摘要 |
<p>PROBLEM TO BE SOLVED: To suppress press concentration to four points at the corner part of a wafer, and eliminate a cut-out and a crack by allowing two sides of the wafer to be brought into line contact with a mount surface when the mount surface of the wafer is set to a slantingly and nearly V shape and a rectangular wafer is mounted on a body. SOLUTION: A wafer mount surface 1-1 is slantingly formed in a nearly V shape from the top part of an outer-periphery side-face part 1-2 of a body toward the bottom part of the body. On the wafer mount surface 1-1, a rectangular wafer 4 is mounted in an A-A direction of the mount surface 1-1 so that two sides of the rectangular wafer 4 are brought into contact with the wafer mount surface 1-1. Then, a belleville spring 2 with a cutout is mounted on the wafer 4, furthermore, a screwing lid is covered on the spring 2, and the lid is rotated, is screwed, and is mounted independently while press is applied to the spring 2. In this manner, when the wafer 4 is mounted on the mount surface 1-1, the two sides of the wafer 4 are brought into line contact with the mount surface 1-1, thus preventing the press from being concentrated to the four points at the corner part of the wafer 4.</p> |
