| 摘要 |
<p>PROBLEM TO BE SOLVED: To efficiently dissipate the heat generated from a chip part contained in a cavity of a substrate. SOLUTION: A chip part 5 is packaged in a cavity 3 provided in a substrate 2, while a plate 7 having a plurality of holes 8 is fixed on a stepped part 3a of the cavity 3. Next, the cavity 3 is filled with resin 9 via the holes 8. At this time, the swell in the resin 9 due to surface tension can be suppressed by the plate 7. Then, since a part of the filled resin 9 passes through the holes 8 of the plate 7, the surface 9a of the resin 9 is formed into raggedness on the plate 7. The surface 9a of the resin 9 is formed into ruggedness to make the surface area larger than that of a flat surface, thereby heat dissipation from the surface 9a of the resin 9 is facilitated and reliability is improved.</p> |
