| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electrostatic chuck, wherein the contamination by the particles of a sucked body to be sucked is less. SOLUTION: An electrode 2 and an insulating layer 3 which arranged thereon are provided. A voltage is applied on the electrode 2. As a result, an electrostatic chuck, which electrostatically sucks a body to be sucked W, is constituted on the insulating layer 3. A suction surface 3a, which sucks at least the body to be sucked W of the insulting layer 3 is constituted of resin, the pencil hardness of which is 5H or lower. Thus, the generation of particles becomes less, and the electrostatic chuck, in which the contamination by the particles with respect to the wafer W is less, can be obtained.</p> |
