发明名称 |
CERIUM OXIDE ABRASIVE AND GRINDING OF SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To obtain a cerium oxide abrasive intended for high-speed grinding of the surface of SiO2 insulation films to-be-ground of the like without causing ant scratches. SOLUTION: This cerium oxide abrasive comprises a slurry which is prepared by dispersing in a medium cerium oxide particles 150-600 nm in the median of size produced by using cerium carbonate as raw material 0.3-5 μm in the median of particle size distribution. An Si wafer provided with an SiO2 insulation film made by tetraethoxysilane(TEOS)-CVD method or the like is ground with this abrasive. |
申请公布号 |
JPH11181404(A) |
申请公布日期 |
1999.07.06 |
申请号 |
JP19970349241 |
申请日期 |
1997.12.18 |
申请人 |
HITACHI CHEM CO LTD |
发明人 |
ASHIZAWA TORANOSUKE;OTSUKI HIROTO;YOSHIDA MASATO;TERASAKI HIROKI;KURATA YASUSHI;MATSUZAWA JUN;TANNO KIYOHITO;SAKURADA TAKASHI |
分类号 |
B24B37/00;C01F17/00;C09K3/14;H01L21/304 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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