发明名称 CERIUM OXIDE ABRASIVE AND GRINDING OF SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To obtain a cerium oxide abrasive intended for high-speed grinding of the surface of SiO2 insulation films to-be-ground of the like without causing ant scratches. SOLUTION: This cerium oxide abrasive comprises a slurry which is prepared by dispersing in a medium cerium oxide particles 150-600 nm in the median of size produced by using cerium carbonate as raw material 0.3-5 μm in the median of particle size distribution. An Si wafer provided with an SiO2 insulation film made by tetraethoxysilane(TEOS)-CVD method or the like is ground with this abrasive.
申请公布号 JPH11181404(A) 申请公布日期 1999.07.06
申请号 JP19970349241 申请日期 1997.12.18
申请人 HITACHI CHEM CO LTD 发明人 ASHIZAWA TORANOSUKE;OTSUKI HIROTO;YOSHIDA MASATO;TERASAKI HIROKI;KURATA YASUSHI;MATSUZAWA JUN;TANNO KIYOHITO;SAKURADA TAKASHI
分类号 B24B37/00;C01F17/00;C09K3/14;H01L21/304 主分类号 B24B37/00
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