发明名称 |
Rigidized lead frame for a semiconductor device |
摘要 |
In semiconductor device fabrication, warping of the support pins must be prevented so that the semiconductor element can be properly positioned during the wire-bonding and resin-sealing processes. The invention provides a process in which a V-shaped groove 33, for example, is formed in the mounting pad 31 and the support pins 32, imparting rigidity to the support pins 32.
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申请公布号 |
US5920116(A) |
申请公布日期 |
1999.07.06 |
申请号 |
US19960757880 |
申请日期 |
1996.11.27 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
UMEHARA, NORITO;KARASHIMA, AKIRA |
分类号 |
H01L23/50;H01L23/495;(IPC1-7):H01L23/495;H01L23/28 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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