| 摘要 |
PROBLEM TO BE SOLVED: To properly absorb a noise if penetrating in a wiring layer of an insulation board from a wiring conductor of an external electric circuit board, thereby effectively preventing the noise from getting into its semiconductor device to normally operate the semiconductor device for a long time. SOLUTION: The package comprises an insulation board 1 having a semiconductor device mounting part 1a on the top surface and wiring layers 8 led to bottom surface from the mounting part 1a, and cover 2 mounted on the board 1 to seal a semiconductor device mounted on the mounting part. The board 1 is formed by laminating SiO2 -Al2 O3 -MgO-ZnO-B2 O3 crystalline glass- made insulation layer 4, 5, 6, and a lowest insulation layer 4 is a magnetic insulation layer 4a contg. a magnetic material. |
