发明名称 WAFER MEASURING DEVICE
摘要 PROBLEM TO BE SOLVED: To keep the relative place of a heating stage to the surface of a probe card approximately constant from the start of a temperature test to completion by correcting the place of the heating stage on the basis of the temperature of the probe card and pressure brought into contact with a connecting member. SOLUTION: A plurality of temperature sensors 32a-32d are installed onto the top face of a probe card in the radial direction. A temperature mean value TAVE is arithmetically operated by a temperature mean-value arithmetic means 42 on the basis of the detecting values of the temperature sensors. Pressure sensors 31a-31d are mounted on the radial outside of the temperature sensor 32a-32d, and contact pressure to an inner ring is detected. A pressure mean value PAVE is arithmetically operated by a pressure mean-value arithmetic means 41 on the basis of the detected values of the pressure sensors. A correction valueΔH at the driving distance of a heating stage is obtained on the basis of the pressure mean value PAVE and the temperature mean value TAVE by a place correction selection means 44. A heating-stage drive mechanism 53 is driven according to a corrected travel HREF+H that is the sum of the correction valueΔH and a reference travel HREF.
申请公布号 JPH11176893(A) 申请公布日期 1999.07.02
申请号 JP19970344922 申请日期 1997.12.15
申请人 TOSHIBA CORP 发明人 TSUKAGOSHI HISAO
分类号 G01R31/26;H01L21/66;(IPC1-7):H01L21/66 主分类号 G01R31/26
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