发明名称 |
Circuit-board overlaid with a copper material on both sides or in multiple layers and a method of fabricating same |
摘要 |
A circuit-board overlaid with a copper material on both sides with a lead-tin layer on the copper material and a plate-shaped heat sink (6). To achieve desirable dissipation of heat generated by electronic components on such circuit-board, the heat sink (6) is provided with a copper surface and then a layer of silver (8) applied to it is soldered to one side of the circuit-board (1). In a method of fabricating the circuit-board, a heat sink (6) having a copper surface is provided with a silver layer (8) and is applied to the circuit board (1) with its side (7) having the silver layer (8). The heat sink (6) is pressed with the circuit board (1) and a heated platen (20) in close contact with the heat sink (6).
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申请公布号 |
US5914861(A) |
申请公布日期 |
1999.06.22 |
申请号 |
US19970996356 |
申请日期 |
1997.12.22 |
申请人 |
SIEMENS AG;PPC ELECTRONIC AG |
发明人 |
RICHTER, DIETRICH;STRAUB, PETER;LANCKI, MARIAN;DIEHM, PETER;BERCHTOLD, DIETER;WISSMEIER, HANS-GEORG |
分类号 |
H05K1/02;H05K3/00;H05K3/34;(IPC1-7):H05K7/20 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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