WAFER TABLE FOR DIE BONDING,申请号KR19960035765U-传众专利搜索

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发明名称	WAFER TABLE FOR DIE BONDING
摘要
申请公布号	KR200146348(Y1)	申请公布日期	1999.06.15
申请号	KR19960035765U	申请日期	1996.10.28
申请人	HYUNDAI MICRO ELECTRONICS CO.,LTD.	发明人	LEE, JAE-HYOK
分类号	H01L21/60	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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