| 摘要 |
A leadframe for semiconductor derides having patterned die-mounting structures arranged along the longitudinal axis of the leadframe. Each of the structures contains a die pad for mounting a semiconductor device chip thereon, die pad supports for supporting the die pad, fingers for forming inner leads and outer leads, and tiebars for preventing leakage of a molding material during a molding process. At least one of the die pad supports has a first communication path through which a molding material flows from one side of the body to the other thereof. The molding material supplied into one side of the leadframe can flow to the other side thereof through not only the gaps between the die pad and the body but also the first communication path during a molding process, resulting in a small flow rate difference of the molding material. Failures such as visible voids and no fillings are not produced in the plastic-molding package. |
