PROCESSING SOLUTION DISCHARGE NOZZLE AND SUBSTRATE TREATING DEVICE PROVIDED WITH THE NOZZLE

摘要

PROBLEM TO BE SOLVED: To provide a processing soln. discharge nozzle for exhausting the air generated in the processing soln. reservoir of the discharge nozzle and a substrate treating device provided with the nozzle. SOLUTION: This processing soln. discharge nozzle 4 is formed by a casing 40 communicating with and connected to a pipe 41 for sending the processing soln. The ceiling face 40c of the processing soln. reservoir 40a as a space in the casing 40 is inclined up toward an air vent hole 40d. The air generated and grown in the reservoir 40a is conducted to the air vent hole 40d along the ceiling face 40c by its buoyancy. Further, since the processing soln. supplied from the pipe 41 is also discharged from the vent hole 40d as well as from the discharge hole 40b, the air depositing on the ceiling face 40c is swept away by the soln. flowing into the vent hole 40d and discharged from a waste liq. pipe 42 connected to the vent hole 40d.