发明名称 LIQUID HEATING SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a liquid heating system in which the elevation of temperature of the outer panel of a casing can be suppressed and the installing space efficiency can be improved by effectively cooling a plate body forming a burning gas path. SOLUTION: Concerning the liquid heating system in which a burner 5 is arranged under the base of a liquid tank 4 and the temperature of liquid in the liquid tank is elevated by heating the base of the liquid tank 4 with the burner 5, by providing plate bodies at prescribed intervals outside the base and back of the liquid tank 4, a burning gas path 15 communicated to the burning chamber of the burner 5 is formed, a cooling air path 16 along with the burning gas path 15 are formed outside the burning gas path 15, and the downstream side of the burning gas path 15 and the downstream side of the cooling air path 16 are joined so as to be opened in the air. The joining point of the burning gas path 15 and the cooling air path 16 is provided at the upper part of the back of the liquid tank 4, for example, and the opening of the cooling air path 16 on the upstream side is provided on a bottom part 26 of the casing for housing and installing the liquid tank 4.
申请公布号 JPH11155743(A) 申请公布日期 1999.06.15
申请号 JP19970339479 申请日期 1997.11.26
申请人 EIKEN INDUSTRIES CO LTD 发明人 FURUHASHI TOSHIO
分类号 A23L7/109;A47J27/14;A47J37/12 主分类号 A23L7/109
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