发明名称 POLYAMIDE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain the subject composition that has high heat distortion temperature, even when the mold temperature is low on molding and gives molded products of excellent resistances to chemicals and shocks with reduced variation in physical properties caused by water absorption and reduced thermal decomposition during the elevated temperature processing by using a specific crystalline partial aromatic polyamide together with a specific ethylenic polymer and a polyolefin. SOLUTION: This polyamide resin composition comprises (A) 65-85 pts.wt. of crystalline partial aromatic polyamide containing the recurring units of formulas I and II [n is 45-80 wt.%; m is 55-22 wt.%], (B) 10-35 pts.wt. of an ethylene- acrylic ester-maleic acid terpolymer and (C) 3-15 pts.wt. of a polyolefin. In the component A, the units of hexamethylene terephthalamide of formula I preferably occupies 50-60%, while the unit of hexamethylene adipamide does 50-40%. In the component B, the amount of acrylic ester to be copolymerized is preferably 5-15%. This composition is suitably used as a wire harness.
申请公布号 JPH11158372(A) 申请公布日期 1999.06.15
申请号 JP19970328301 申请日期 1997.11.28
申请人 TOYOBO CO LTD 发明人 TAMURA TSUTOMU;TAKEUCHI MANABU
分类号 C08L77/06;(IPC1-7):C08L77/06 主分类号 C08L77/06
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