摘要 |
PROBLEM TO BE SOLVED: To obtain the subject composition that has high heat distortion temperature, even when the mold temperature is low on molding and gives molded products of excellent resistances to chemicals and shocks with reduced variation in physical properties caused by water absorption and reduced thermal decomposition during the elevated temperature processing by using a specific crystalline partial aromatic polyamide together with a specific ethylenic polymer and a polyolefin. SOLUTION: This polyamide resin composition comprises (A) 65-85 pts.wt. of crystalline partial aromatic polyamide containing the recurring units of formulas I and II [n is 45-80 wt.%; m is 55-22 wt.%], (B) 10-35 pts.wt. of an ethylene- acrylic ester-maleic acid terpolymer and (C) 3-15 pts.wt. of a polyolefin. In the component A, the units of hexamethylene terephthalamide of formula I preferably occupies 50-60%, while the unit of hexamethylene adipamide does 50-40%. In the component B, the amount of acrylic ester to be copolymerized is preferably 5-15%. This composition is suitably used as a wire harness. |