发明名称 AUTOMATIC MODULAR WAFER SUBSTRATE HANDLING DEVICE
摘要 <p>The object of the invention is to provide an automatic module and cassette station detecting and aligning semiconductor wafer/substrate material handling unit with a thermal processing chamber module having an integrated, sturdy, chemical and temperature resistant wafer lift pins and door actuation apparatus. One of the benefits that is derived from this apparatus is the ability to quickly and easily attach various processing modules at any docking position of the semiconductor wafer/substrate material handling unit (hereinafter MHU). The MHU of this apparatus has the additional benefit of a cassette station that automatically aligns and detects a plurality of different size and shape semiconductor wafer/substrate cassettes. The semiconductor wafer/substrate cassettes may also be functionally attached to a module that is docked to the MHU for use.</p>
申请公布号 WO1999027566(A1) 申请公布日期 1999.06.03
申请号 US1998024807 申请日期 1998.11.20
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