| 摘要 |
PROBLEM TO BE SOLVED: To prepare a sufficiently thin high-molecular-weight epoxy film having sufficient strengths, heat resistance, chemical resistance and bondability and an epoxy resin composition capable of being molded thereinto. SOLUTION: There is provided an epoxy resin composition comprising a high-molecular-weight epoxy polymer obtained by polymerizing a bifunctional epoxy resin with a bifunctional phenol by heating in the presence of an alkali metal compound catalyst in a solvent, an epoxy polymer obtained by polymerizing a bifunctional epoxy resin with a bifunctional phenol by heating in the presence of an alkali-metal-element-free compound catalyst in a solvent, a polyfunctional epoxy resin, an epoxy resin curing agent and a high-molecular- weight epoxy polymer crosslinking agent. The epoxy resin composition as a varnish is applied to a substrate and dried to obtain a high-molecular-weight epoxy film. |
