发明名称 |
Photosensitive resin composition and photosensitive element using the resin composition |
摘要 |
<p>A photosensitive resin composition and a photosensitive element using the resin composition with excellent sensitivity and adhesion as well as high resolution and plating resistance. A photosensitive resin composition comprises (A) a polymer carrying carboxyl groups, (B) a compound carrying at least one ethylene-based unsaturated group in the molecule, and (C) a photopolymerization initiator. Component (B) contains at least 60 wt.% of methacrylate (B1), carrying at least one ethylene-based unsaturated group, with respect to the total amount of component (B). The amount of component (C) is in the range of 0.01-20 weight parts per 100 weight parts of components (A) (B), and components (C) contains 2-5 weight parts of lophine dimer (C1) and 0.1-2.0 weight parts of triphenylphosphine (C2) per 100 weight parts of components (A) (B).</p> |
申请公布号 |
EP0919870(A1) |
申请公布日期 |
1999.06.02 |
申请号 |
EP19980309562 |
申请日期 |
1998.11.23 |
申请人 |
NICHIGO-MORTON CO LTD |
发明人 |
KOSAKA, EIJI;MURAKAMI, SHIGERU |
分类号 |
C08F2/50;C08F220/10;C08F290/06;C08L33/02;G03F7/027;G03F7/028;H05K3/06;(IPC1-7):G03F7/027 |
主分类号 |
C08F2/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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