| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wafer working equipment and a detecting method of wafer levitation, in which the levitation of a wafer 10 a treatment chamber can be detected during a gas stabilizing time after treatment gas has been introduced. SOLUTION: In a wafer working equipment, treatment gas is introduced in a treatment chamber 3, and a specified treatment is performed on the surface of a wafer 7 mounted in the treatment chamber 3. A pressure measuring means 31 for measuring the pressure of the back of the wafer 7 during a gas stabilizing time after treatment gas is introduced into the treatment chamber 3, and a detecting means 33 which measures a pressure changing value of the back of the wafer 7 on the basis of the measurement result outputted from the pressure measuring means 31, and detects generation of levitation of the wafer 7 on the basis of the pressure changing value are installed.</p> |
