| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which one kind of lead frame can be shared among semiconductor chips of different size and a chip up to such a size which is allowable by a package can be mounted. SOLUTION: A semiconductor device comprises a semiconductor chip 1, an island part 2 of a lead frame for mounting the chip, an inner lead part 4 of the lead frame being connected with the electrodes on the chip through a bonding wire 3, and a resin package 5 for molding the chip, the island part and the inner lead part. The chip 1 is mounted on the projecting side at the island part 2. |
