发明名称 METHOD FOR FORMING THICK-FILM RESISTOR
摘要 <p>PROBLEM TO BE SOLVED: To provide a method for forming a thick-film resistor resistance value precision of which is made high, moisture resistance is made superior, and moreover current noise is made small. SOLUTION: At first, resistance paste is printed and burned. Thereafter, a resistance value is corrected into a desired value by laser trimming so that a resistor can be formed. Then, glass paste with glass frit whose softening point is 350 deg.C-550 deg.C as the main materials is printed and burned at a peak temperature 400 deg.C-550 deg.C so that the resistor can be covered, and an overcoat glass can be formed. Moreover, resin paste is printed and hardened so that the overcoat glass can be covered.</p>
申请公布号 JPH11150009(A) 申请公布日期 1999.06.02
申请号 JP19970333677 申请日期 1997.11.18
申请人 SUMITOMO METAL MINING CO LTD 发明人 MAKUTA FUJIO;KAWAKUBO KATSUHIRO
分类号 H01C17/06;H01C17/24;(IPC1-7):H01C17/06 主分类号 H01C17/06
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