Heat dissipator for large sized central processing unit

摘要

A holder (3) is provided in a groove (13) formed between the two fin blocks (15) of a finned plate (1). The holder has a pair of legs which extends downwards and terminates as two hooks (31). A fold (32) is provided on one of the legs in order to provide spring effect to the holder. The rod presses against the holder and enhances the spring effect. The holder is provided for mounting the heat dissipator onto the circuit device. The hook is provided for clamping the integrated circuit device. The fin blocks are formed by arranging several fins (11) in the form of matrix on the surface of an aluminum made finned plate. Gaps (12) are provided between every two adjacent fins. A board (2) with a rod (28) extending from its bottom surface, is mounted on the finned plate. A wall extends from the edge of the board for enclosing the finned plate.