发明名称 SUBSTRATE PROCESSING EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing equipment which performs a series of processes on a substrate at a high efficiency without increasing the length of a substrate transfer distance. SOLUTION: A substrate processing equipment is provided with a processing part 2, which has a plurality of processing units for performing a series of processes, i.e., development of a target substrate S after resist coating and exposure and etching of the developed substrate S, on the both sides of transfer paths 12, 13, 14, major transfer equipment 17, 18, 19 that shifts along the transfer paths 12, 13, 14 and transfer the substrate between processing units, and a carry in/out part 1 having a transfer mechanism 11 for transferring the substrate S to and from the major transfer equipment 17, 18, 19. Respective processing units of the processing parts 2, the transfer paths 12, 13, 14 and the carry in/out part 1 are integrally arranged.
申请公布号 JPH11145055(A) 申请公布日期 1999.05.28
申请号 JP19980233600 申请日期 1998.08.05
申请人 TOKYO ELECTRON LTD 发明人 KURIKI YASUYUKI;TAKAMORI HIDEYUKI;HARA KOZO
分类号 H01L21/677;G02F1/13;H01L21/027;H01L21/68;(IPC1-7):H01L21/027 主分类号 H01L21/677
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