BUMP BONDING DEVICE AND METHOD THEREFOR,申请号JP19970308519-传众专利搜索

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发明名称	BUMP BONDING DEVICE AND METHOD THEREFOR
摘要
申请公布号	JPH11145175(A)	申请公布日期	1999.05.28
申请号	JP19970308519	申请日期	1997.11.11
申请人	MATSUSHITA ELECTRIC IND CO LTD	发明人	YONEZAWA TAKAHIRO;KANAYAMA SHINJI;YAMAMOTO AKIHIRO;IMANISHI MAKOTO;YOSHIDA KOICHI
分类号	H01L21/60;(IPC1-7):H01L21/60	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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