| 摘要 |
PROBLEM TO BE SOLVED: To provide a transferring equipment and a transferring method of solder balls in which solder balls can be surely vacuum-sucked in a suction hole one by one, and the vacuum-sucked solder balls can be surely transferred to a work when the solder balls are vacuum-sucked in the suction hole of a suction head and transferred to the work. SOLUTION: This transferring equipment of solder balls is provided with a positioning table A for positioning a work 17, a ball pool B for accommodating large number of solder balls 19, a gas supplying means E for supplying gas to the ball pool B, a suction head C which has a suction hole, picks up the solder balls 19 from the ball pool B by vacuum suction, drops the solder balls 19 and transfers the solder balls 19 to a work 17, a transferring means D for transferring the suction head C between the ball pool B and the work 17, and a vibrator 29 for giving vibration to the solder balls 19 held by the suction head C. |
