PLATED NON-CONDUCTIVE PRODUCTS AND PLATING METHOD FOR THE SAME

摘要

Object A method of forming a plate layer with extremely high adhesiveness on a surface of a non-conductive product. Solution A method of plating a non-conductive product comprising the steps of: forming a coating film on necessary portions of a surface of the non-conductive product with a conductive paint having the following composition of solid ingredients: (A) resin vehicles 20 to 80 weight % (B) conductive whisker 80 to 20 weight %, and executing electroless plating on a surface of the coating film, or a method for improving adhesiveness of a plate layer by forming , when forming a coating film, microvoids in a surface of the coating film.