| 摘要 |
PROBLEM TO BE SOLVED: To reduce a mounting area to a circuit board to thereby reduce the circuit board, thus compacting a circuit device to be mounted. SOLUTION: An IC package 1 comprises leads 12 disposed on the back surface 11B of a tape 11 and semiconductor elements 14 which are mounted on the front surface 11F of the tape 11 and electrically connected to the leads 12. The leads 12 passing over the side end face 11E of the tape 11 are bent to the front surface 11F of the tape 11 and closely fixed to this tape surface 11S. |
